A Novel Deep Eutectic Solvent Developed as a Medium for Ni Electrodeposition

Abstract

The study involved preparing a deep eutectic solvent containing a 1:4 stoichiometric mixture of lithium chloride and 1, 2-propandiol to investigate Nickel electrodeposition. The electrochemical characteristics of nickel electrolytes in the absence and addition of additives have been studied using electrochemical techniques such as cyclic voltammetry measurement. In addition, in the absence and presence of additives, the effect of the deep eutectic solvent in the electroplating process on a copper substrate was investigated. Using atomic force microscopy, scanning electron microscopy, and X-ray diffraction, the deposited nickel's roughness, thickness, and surface morphology were identified, revealing that additives function as a very efficient brightener, permitting the development of homogenous and flat nickel deposits.